Taiwanese semiconductor manufacturer MediaTek is all geared up to introduce the new Dimensity 900. The chip belongs to upper mid-range 5G devices. The company has shared a complete set of specifications, which we will review shortly.
Back in November 2019, MediaTek introduced its first 5G SoC, the Dimensity 1000. This innovation changed a lot for the company, and since then, the company has launched several chips in its 5G-capable Dimensity series for phones across various price points. We also received the Dimensity 1100 and the Dimensity 1200 this year, which is, again, for flagship 5G devices.
This new MediaTek Dimensity 900 is fabricated on TSMC’s 6nm process, featuring an integrated 5G modem that supports 5G NSA and SA modes, 5G carrier aggregation (FDD/TDD), Dynamic Spectrum Sharing (DSS), and VoNR support.
MediaTek Dimensity 900: Specifications
|Specification||MediaTek Dimensity 900|
|CPU||2x ARM Cortex-A78 @up to 2.4GHz6x ARM Cortex-A55 @up to 2GHz|
|GPU||ARM Mali-G68 MC4|
|Memory||LPDDR5/LPDDR4xUFS 3.1/UFS 2.2|
|Camera||Max camera ISP: 108MP, 20MP + 20MPMax video capture resolution: 3840 x 2160Camera features: Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine|
|AI||Third-gen MediaTek APU|
|Video Encoding||H.264, H.265 / HEVC|
|Video Playback||H.264, H.265 / HEVC, MPEG-1/2/4, VP-9, AV1|
|Display||Max display resolution: 2520 x 1080Max refresh rate: 120HzMediaTek MiraVision HDR Video|
|Connectivity||Cellular: 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMAWi-Fi 6 (2X2 MIMO)Bluetooth 5.2Multi-GNSS L1+L5|
|Modem||5G NR sub-6GHz|
According to reports, this chipset would reach its market in Q2 of 2021.
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