MediaTek recently announced the new Dimensity 9000 5G SoC at the recent launch event. The chipset will compete with Qualcomm’s Snapdragon 898 and is built on TSMC’s 4nm process. Reports are now coming that MediaTek is also working on another chipset, which could be the upper mid-range chipset – Dimensity 7000.
The most prominent thing about this chipset is the 75W charging support, which brings it between Qualcomm’s Snapdragon 870 and the 888. The chipset will be based on ARM’s new V9 architecture.
The Dimensity 7000 will be built on TSMC’s 5nm process. Reports are suggesting that MediaTek has already started testing this processor and might soon come into the limelight.
Although the company hasn’t confirmed the news, we have heard that a new Xiaomi smartphone – Xiaomi Rubens – will use this 5nm process chipset under its helm. This Ruben is also tipped to be known as the Redmi K50 Gaming Standard Edition and might come in April 2022 in China.
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